"Co-design and co-analysis of silicon and advanced packages with Synopsys' 3DIC Compiler platform is another example of how our close collaboration results in advanced productivity solutions that ...

3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like high-performance computing (HPC), automotive and mobile. "Applications such as AI ...

Alchip’s 3DIC design flow also covers thermal characterization to increase power density, perform 3D non-uniform power mapping, mitigate 3D thermal crosstalk effects, and provide package and system ...

Alchip’s newly available 3DIC design flow addresses power integration ... and OSAT partners to accelerate multi-die designs,” explained Erez Shaizaf, Alchip’s chief technology officer.

Alchip’s 3DIC design flow also covers thermal characterization to increase power density, perform 3D non-uniform power mapping, mitigate 3D thermal crosstalk effects, and provide package and system ...

Alchip's 3DIC design flow also covers thermal characterization to increase power density, perform 3D non-uniform power mapping, mitigate 3D thermal crosstalk effects, and provide package and system ...

16, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high ...

16, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high ...