By far, the most cited reason why companies don’t adopt advanced packaging is cost. Currently, silicon interposers add about $30 to the price of a medium-sized die, according to several industry ...

Advanced packaging provides a way to pack more features and functions into a device ... That can cause mechanical stresses that compromise the integrity of the chips, weaken the bonds that connect ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

While our support for advanced packaging techniques and the use of interposers offers significant benefits, there are practical considerations that make standard packaging a more viable choice in ...

while providing benefits to system design, cost, thermal, test, yield, and production cycle-time by utilizing industry standard packaging. In many applications this eliminates the need for advanced ...

CEA-Leti, a European technology research institute, recently demonstrated a unique technology that may have a disruptive ...