Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market ...

Rayane Mazari, Technology & Cost Analyst, Semiconductor Packaging from Yole Group explains:“There is an increased implementation of high-end systems in high-performance computing, networking, ...

TAICHUNG, Taiwan (Reuters) - Nvidia's (NVDA) demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

Our VertaCure PLP product line is well known for offering a controlled ... creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems ...

TSM's 2025 CapEx expected at $38B-$42B, with increased focus on advanced packaging as AI and 3nm tech ... primarily in line with consensus. More interestingly, management guided AI revenue to ...