The topside cooling technology transfers most heat to the heat sink mounted on the top exposed pad. This feature allows the GTPAK to offer a more effective thermal dissipation route than going through ...

AOS launches two new advanced surface-mount package options for its high power MOSFET portfolio, aimed at high-current ...

Alpha and Omega Semiconductor (AOS) has introduced two new surface-mount package options for its high-power MOSFET portfolio.