because that’s where the whole thing started — from the physical availability of a smaller bump pitch. It’s the same thing today. We are starting to learn in the industry that we will very soon have ...

Febraury 5, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out ...

“UCIe Consortium is living up to its mission and establishing a vibrant chiplet ecosystem as the industry musters around UCIe technology ... end-to-end link layer functionality Cost optimization for ...

Potential defects in bumps and traces are identified early ... "With a comprehensive, silicon-proven 2.5D/3D chiplet IP portfolio across TSMC's 7nm, 5nm, and 3nm process technologies, we deliver ...