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在总结这一发展时，有必要指出，兴森科技的CSP封装基板将有效推动存储及射频芯片更高效地服务于市场。在这股技术浪潮之下，用户也将享受到更多来自设备性能提升带来的好处。Smart technology的进步无疑将对未来生活产生深远影响，值得每一个用户的期待。 返回搜狐，查看更多 ...
兴森科技推出CSP封装基板，开创存储芯片新纪元
在智能设备领域，兴森科技近日在互动平台上透露，其新研发的CSP（Chip Scale Package）封装基板正主要应用于存储芯片、射频芯片以及MEMS（Micro-Electro-Mechanical Systems）芯片等多个领域。随着对高性能芯片的需求不断增加，这一创新技术无疑为设备制造商提供了更强的设计和应用自由度。
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PRNewswire/ -- izmo Microsystems, a division of izmo, Inc parent - izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry partner with IIT Madras in a groundbreaking project at ...