Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

In today’s digital transformation era, the semiconductor industry is witnessing a fundamental shift toward chipset-based architectures, redefining how complex systems are designed and manufactured.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Ayar Labs has unveiled the industry's first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, ...

随着芯片设计向异构组装和3D-IC技术迈进，提供和管理电力已成为芯片制造中的核心挑战，显著增加了设计复杂性，迫使制造商在性能、可靠性和 ...

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly working with Nvidia to develop next-generation GPUs utilizing advanced chiplet technology. This collaboration is expected to play an ...

design cycle times, die size, yield and time to market. The semiconductor ecosystem, including foundries, EDA companies, SoC providers, and assembly and packaging companies, has begun exploring ...

imec, the research and innovation hub, announces new accelerator to lead the development of chiplet-based technologies.

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design. Early information shows a 12-core Zen 6 module built on TSMC’s 3 nm ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...