“Chiplet”和“异构集成”这两个术语频繁出现在新闻页面、会议论文和营销演示中，工程师们大多能够理解他们在阅读的内容。但在演讲过程中，有时会有人在试图确定某个特定芯片是否符合Chiplet的定义时感到困惑，而异构集成对于不同的人来说也有不同的 ...

短期业绩承压之下，芯原正通过"SiPaaS"轻资产模式，持续加码Chiplet、汽车电子等前沿技术，试图在智能驾驶芯片领域开辟新增长极。 当前，全球封装 ...

2022年4月，中国一站式IP和芯片定制及GPU赋能型企业芯动科技宣布，率先推出国产自主研发物理层兼容UCIe标准的IP解决方案——Innolink™ Chiplet。据悉，这是国内首套跨工艺、跨封装的Chiplet（芯粒）连接解决方案，且已在先进工艺上量产验证成功。 3月初英特尔等 ...

随着芯片设计向异构组装和3D-IC技术迈进，提供和管理电力已成为芯片制造中的核心挑战，显著增加了设计复杂性，迫使制造商在性能、可靠性和 ...

Chiplet技术解决的问题 Chiplet技术通过将一个大的芯片分解成多个小的模块（即Chiplet），然后通过高速互连技术将它们组合起来，以实现整个芯片的 ...

For a commercial chiplet marketplace to really take off, it requires a much deeper understanding of how chiplets behave individually and together. There needs to be a consistent way to connect ...

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...

Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...

The semiconductor ecosystem, including foundries, EDA companies, SoC providers, and assembly and packaging companies, has begun exploring chiplet designs due to the decreasing silicon economies of ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...

HyperLight, the industry leader in thin-film lithium niobate (TFLN) technology, today announced the launch of its TFLN Chiplet™ platform, a modular and scalable ecosystem designed to power the ...