Chiplet的真正潜力在于使复杂芯片系统的设计大众化。 小芯片(Chiplet)革命即将到来。多裸晶科学专案从实验室起步，如今已逐渐成熟。像AMD、英特尔 ...

此外，由于位扩展、通道数量的增加、电源加固等因素，封装端子的数量显著增多，封装端子的球尺寸也显著减小。 截至2024年，chiplet（小芯片）一词在半导体行业新闻中频繁出现。据称，小芯片的优势在于其能够以较小的体积存储硅，并以可扩展的方式进行 ...

拆解2024年发布的处理器，考虑Chiplet是否真的合理应用。 通过实现半导体的微型化，并在更小的空间内集成它们，可以显著降低信号传输的延迟时间。

But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...

Its spiral waveguide structure (impossible to build on a passive ... This eliminates delays common in conventional ...

This UCIe chiplet brings highly customizable, package-level integration with die-to-die ... In addition, OUC ensures that the receiver buffer does not overflow at the receiver end. With its ...

SAN RAMON, CA, UNITED STATES, January 14, 2025 -- YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low power devices exist in ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...

SAN DIEGO--(BUSINESS WIRE)--Emphasis is on AI applications. The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its final keynote schedule.