The DDR3, DDR3L, DDR4, and LPDDR4 Combo PHY is designed for easy integration into any System-On-Chip (SOC) and can be seamlessly connected to a third-party DFI-compliant DDR3, DDR3L, DDR4, or LPDDR4 ...

Finalized in 2013, Hybrid Memory Cubes (HMCs) provide 15 times the bandwidth of DDR3 chips while consuming 70% less power and 90% less space. Like DRAM, HMCs lose their content without power.

In this example, a memory module, the signals from the DDR3 PHY come into the middle of the module and connect to each memory chip sequentially. This reduced the number of stubs and the stub lengths.

The downward trend of DRAM chip prices is expected to accelerate this quarter at a quarterly pace of 13 percent at the steepest amid weakness in demand for products such as PCs and server DRAM chips, ...