Heterogeneous integration and packaging technologies are at the forefront of modern electronics, enabling the combination of different materials and components into a single package to enhance ...

The high density and complex connectivity in advanced packaging introduce new challenges for packaging design and assembly ... performance, and area (PPA) in chiplet and heterogeneous integration.

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

Intel Foundry also was first to report a 100x 2 throughput improvement using a heterogeneous integration solution for advanced packaging to enable ultra-fast chip-to-chip assembly. And to further ...

Sources said important projects by companies, including SiCSem Pvt Ltd, RIR Power Ltd and Heterogeneous Integrated Packaging Solutions Pvt Ltd already approved by the state government are waiting ...