Intel will also have an IEDM-invited talk about tomorrow's packaging solutions. This slide above revealed EMIB-T, which hasn't been disclosed previously. As a reminder, EMIB is Intel's Embedded ...

Intel 7 - previously known as Enhanced SuperFin ... Embedded multi-die interconnect bridge (EMIB) has been used in products since 2017 and will continue to be used in Sapphire Rapids next ...

IFS has already secured several high-profile customers interested in using its advanced packaging technologies like EMIB (Embedded Multi-die Interconnect Bridge). As I said before, Intel also owns ...

EMIB allows Intel to build out chips with an ever-increasing number of chiplets. The key is to build high-performance interconnects (think of these as circuit board traces, but running inside ...

The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...