来自MSN1 个月
Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip ...
Intel’s Technology Research team ... This slide above revealed EMIB-T, which hasn't been disclosed previously. As a reminder, EMIB is Intel's Embedded Multi-Die Interconnect Bridge, a low ...
来自MSN1 个月
Intel doesn't plan to bring 3D V-Cache-like tech to consumer CPUs for now — next-gen ...
On the outskirts lie two I/O chiplets - connected to the CPU tiles through EMIB 3.5D ... It shows that Intel (or rather Intel Foundry) does have the technology to combat AMD's 3D V-Cache ...
ZDNet7 个月
Moore's Law Under the Microscope: Intel Advances Process & Packaging
EMIB allows Intel to build out chips with an ever-increasing ... Intel is solving this with RibbonFET and another technology called PowerVIA. RibbonFET describes how the "source" and "drain ...
CRN3 年
Intel’s $3.5B New Mexico Campus Upgrade To Boost Next-Gen Chips
The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...