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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024Intel’s Technology Research team ... This slide above revealed EMIB-T, which hasn't been disclosed previously. As a reminder, EMIB is Intel's Embedded Multi-Die Interconnect Bridge, a low ...
The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...
On the outskirts lie two I/O chiplets - connected to the CPU tiles through EMIB 3.5D ... It shows that Intel (or rather Intel Foundry) does have the technology to combat AMD's 3D V-Cache ...
At its Accelerated event, Intel had a bunch of stuff to announce ... We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system ...
EMIB allows Intel to build out chips with an ever-increasing ... Intel is solving this with RibbonFET and another technology called PowerVIA. RibbonFET describes how the "source" and "drain ...
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