还是前些天苹果公司发布的M1 Ultra芯片，都使用了Chiplet技术，而且AMD的Chiplet CPU也被证明是非常成功的产品。” 高专呼吁，就目前来看，UCIe规范在软件协议层还有物理层都比较切合Chiplet的应用场景，国内公司可以积极参入UCIe生态，积极推出具有竞争力的基于UCIe ...

3月25日，半导体封装技术厂商Sarcina Technology宣布，推出其创新的 AI Chiplet平台 ... 的 FOCoS-CL（Fan-Out Chip-on-Substrate-Chip Last）封装技术，包括一个中介 ...

Together, OIC and OUC make it easy to extend on-chip interconnects to form multi-chiplet interconnects, utilizing OIC's ActiveQoS and efficient bandwidth transfer capabilities across multiple chips, ...

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design ... fitting well with current trends in chip design and manufacturing.

On January 21, the company announced the launch of Chiplet PHY Designer 2025, an enhanced software solution aimed to design and develop high-speed digital chiplets used in AI and data center ...

HyperLight, creator of the TFLN Chiplet™ platform, today announced the launch of its groundbreaking 110 GHz Low Vπ Intensity Modulator, featuring industry-standard optical fiber and microwave ...