Underfill also improves thermal cycling performance, prevents moisture ingress, and mitigates the risk of solder joint failure, thereby extending the lifespan of electronic components. Essemtec’s ...

SAN DIEGO, CA ― As a wave of experienced engineers and technicians retire, the Surface Mount Technology (SMT) manufacturing industry faces a critical challenge: this looming skills gap threatens ...

Solder paste printing is one of the most critical steps in SMT assembly, directly influencing component placement and solder joint integrity. Even slight deviations—such as misalignment, insufficient ...