May 29 /PRNewswire/ -- Underscoring its commitment to leading-edge assembly technology, Actel Corporation (Nasdaq: ACTL), a supplier of innovative programmable logic solutions, today announced the ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale ... the package laterally, while using TSMC’s 3D packaging technologies to stack ...

If one of the chips consumes higher power, it can be placed at the bottom and stacked face-down to an area-bump package. For high-performance and scaled systems, TSV may be necessary to provide power ...