“启明935A”并不是一颗芯片，而是一个家族系列。通过启明935 HUB Chiplet和不同数量的大熊星座 AI Chiplet配置，结合灵活的封装方式，可快速集成不同 ...

Chiplet: A small functional block that can be combined with other chiplets to create a complete system on a chip. Through-Silicon Via (TSV): A vertical electrical connection that passes through a ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...

SAN DIEGO--(BUSINESS WIRE)--Chiplet Summit’s 2025 event offers the last word on leading-edge chip design at the Santa Clara Convention Center on January 21-23. The Tuesday tutorials cover ...