But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...

Chiplet: A small functional block that can be combined with other chiplets to create a complete system on a chip. Through-Silicon Via (TSV): A vertical electrical connection that passes through a ...

OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

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