UCIe 2.0 于 2024 年 8 月发布，宣称具有更高的带宽密度和更高的功率效率，以及支持 3D 封装、可管理的系统架构等新功能。该标准由主要行业领导者推动，包括 ASE、阿里巴巴、AMD、Arm、Google ...

此外，由于位扩展、通道数量的增加、电源加固等因素，封装端子的数量显著增多，封装端子的球尺寸也显著减小。 截至2024年，chiplet（小芯片）一词在半导体行业新闻中频繁出现。据称，小芯片的优势在于其能够以较小的体积存储硅，并以可扩展的方式进行 ...

Chiplet: A small functional block that can be combined with other chiplets to create a complete system on a chip. Through-Silicon Via (TSV): A vertical electrical connection that passes through a ...

OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...

SAN RAMON, CA, UNITED STATES, January 14, 2025 -- YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low power devices exist in ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...