Applied Materials, Inc. has made a strategic move in the semiconductor industry by purchasing a 9% stake in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment. This ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.

The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during ...

So after spin coating, we bake the wafers and then bond them. And often the material needs to be cured to stabilize the ... which gives a final thickness variation in the range of several microns,” ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...

“EVG has more than 30 years of experience providing production wafer bonding systems for the MEMS industry. Working closely with our customers and partners, we can see key trends and inflection points ...

SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor ...

Additionally, the SB6e and SB8e chamber, tooling, and fixtures are used in SUSS' ABC200 and CBC200 production cluster tools which allows easy technology process transfer from low volume production to ...