It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services ...

Amkor Technology, Inc.’s AMKR share price has dipped by 14.95%, which has investors questioning if this is right time to buy.

through direct low-temperature wafer-to-wafer bonding, G-ray created a monolithic CMOS integrated pixel-array detector that is free of bump bonding and through-silicon vias (TSVs). The bonding ...

Its offering includes professional packaging and testing services, such as semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final testing ...

A breakthrough in next-generation semiconductor technology has been announced by Chinese researchers, with the creation of the world’s largest N-polar gallium nitride (GaN) wafer, at eight ...