Molex has launched a new line of EMI-filtered interconnects and RF components for aerospace and defense applications.

A likely solution involves replacing copper with ruthenium (Ru) interconnects at the lowest, tightest levels, perhaps as soon as the 14 Å node. And, though it is possible to stay with the existing ...

Summary Chipmakers are reaching the limits of copper and tungsten interconnects as devices shrink. To sustain performance, the industry is eyeing ruthenium for logic interconnects and molybdenum for ...

In this modern era, high-performance computing (HPC) systems have become essential in addressing the increasing complexity of ...

"These new RF components and EMI-Filtered interconnects extend Molex's legacy of RF excellence while adding significant product breadth and depth for tackling the toughest connectivity challenges," ...

Chip maker STMicroelectronics (ST) has revealed details of a new generation of proprietary technologies enabling faster ...

As the CPU speed reaches 3GHz and beyond, the I/O performance of a PC has increasingly become the bottleneck of the overall system performance. Traditionally, the I/O- subsystems are connected to the ...

STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters New silicon photonics and next-gen ...

STMicroelectronics has launched a new data center photonics chip, developed in collaboration with AWS. Dubbed the PIC100, ...

FNU Parshant's research highlights the impact of scalable interconnects and energy-efficient SoC designs in HPC ...