Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

US e-commerce giant Amazon has rolled out a new packaging design for its electronic devices, boasting that it is 100% recyclable. The revamped packaging, which began distribution this October ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

We also study the development of innovative materials and production techniques that can transform the electronics packaging, food, and medical/pharmaceutical packaging industries, concerns for food ...

In order to meet this growing demand, GF’s New York Advanced Packaging and Photonics Center is expected to offer: Advanced packaging, assembly and testing for GF’s differentiated silicon photonics ...

US foundry GlobalFoundries Inc. has said it plans to create a center for advanced packaging and test of chips within its New ...