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Siemens inks deal with Alphawave for high-speed IP offerings
Tony Pialis, president and CEO of Alphawave Semi, highlighted the importance of their technologies in reducing interconnect bottlenecks and expressed that the agreement with Siemens would simplify ...
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'Copper’s time has run out': Nvidia, AMD and TSMC have invested millions in a startup which may hold the key to faster chip connectivity to quench AI's thirst for bytes
Ayar Labs’ optical I/O technology eliminates traditional interconnect bottlenecks by enabling data movement at speeds required for large-scale AI workloads. By reducing latency, power ...
Hyperlume Raises $12.5 Million Seed Round to Revolutionize AI Data Center Connectivity
Hyperlume, Inc. ("Hyperlume" or the "Company") has completed a $12,500,000 USD seed round to commercialize its high bandwidth, low latency, low power interconnects for AI data centers and ...
TMCnet3d
Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric
Baya Systems, a leader in high-performance semiconductor system technologies, today announced its new NeuraScale™ switch fabric technology designed to overcome critical scaling and data movement ...
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Hyperlume Raises $12.5 Million Seed Round to Revolutionize AI Data Center Connectivity
Hyperlume's novel technology is designed to overcome the energy and bandwidth bottlenecks inherent in traditional electronic interconnects, offering pluggable, mid-board and co-packaged optical ...