These breakthrough results pave the way towards low-power and high-density monolithic 3D-DRAM memories. Scaling traditional 1T1C (one transistor one capacitor) DRAM memories beyond 32Gb die density ...

DRAM has faced challenges in achieving a similar 3D architecture. The primary obstacle has been the need for a sufficiently large means of storing charge, typically in the form of a capacitor.

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...

DRAM is the type of RAM you find on the RAM cards inserted into your motherboard. It consists of a massive array of capacitors and transistors. Each bit requires one transistor and one capacitor ...

San Jose, California, May 13, 2024 – NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell ...

ONTO recently inked a $69 million volume purchase deal with a top DRAM manufacturer ... key advancements in its product suite for 3D interconnect process control, unveiling the 3Di technology ...