Their discussion of 3D stacking largely focuses on high bandwidth memory (HBM) chips, which are the memory ... one trillion transistors on a single GPU in a decade isn't out of the range of ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

[Devon] decided to make a proper thermal solution by 3D printing a mount that carries three fans along with an air duct that snaps onto the GPU card. In order to prevent unnecessary fan noise ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

随着AI技术的不断发展，市场对于存储器的需求日益增长，预计HBM的整体现量将在未来几年内有所提升；然而，DeepSeek的出现可能会导致高规格HBM产品的需求减缓。业内专家指出，若越来越多的AI企业采取低规格、低成本的解决方案，这将让高端HBM市场面 ...

The chip is being produced using TSMC’s advanced 3-nanometer process and will feature a commonly used systolic array architecture, HBM, and advanced networking capabilities. OpenAI and TSMC ...

NEOX™ IP pre-evaluation systems are available for customer testing and Think Silicon will be demonstrating 3D/2D graphics and machine learning applications at Embedded World. Think Silicon’s new ...