Traditional CNN-based models often struggle with class imbalances and recognition of the multiple overlapping defect types in wafer maps. To address these challenges, we propose ViT-Tiny, a ...

Thin wafers also play a pivotal role in assembling fan-out wafer-level packages and advanced 2.5D and 3D packages for AI applications, which are growing at a much faster rate than mainstream ICs. Add ...

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

A new AI tool builds sophisticated map of mouse brains. It is a detailed view of the brain like never seen before. In a significant technological leap, University of Florida researchers have ...

Two-dimensional (2D) semiconductor materials could enable the development of smaller yet highly performing electronic ...

In a significant technological leap, University of Florida researchers have created a powerful new computational and artificial intelligence tool that can generate a high-resolution 3D map of the ...

This research on sputtered ITO films uncovers how growth conditions affect resistivity, emphasizing the need for uniform ...

nd.add_layer(name ="Coarse and Fine" , layer = 2, accuracy = 0.001, overwrite=True) nd.add_layer(name ="Pattern" , layer = 3, accuracy = 0.001, overwrite=True) nd.add ...

Scientists in China have discovered a better way to build small, high-performance electronic parts using ultra-thin materials ...

Minitab brings more than 50 years’ worth of expertise in helping manufacturers boost production yields and reduce errors with ...