Apparently, the semiconductor industry is eying a new set of advanced packaging building blocks to dramatically increase the bandwidth and interconnect density of AI chips. TSMC’s CoWoS is a 2.5D ...

The field of advanced packaging in particular is undergoing significant change ... and more energy efficient. However, this high density of components also harbors new security risks. The more ...

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market ...

Rayane Mazari, Technology & Cost Analyst, Semiconductor Packaging from Yole Group explains:“There is an increased implementation of high-end systems in high-performance computing, networking, ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

17, 2025 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and ... bandwidth and density requirements in datacenters ...

MALTA – GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing ... bandwidth and density requirements in datacenters and edge devices.

G lobalFoundries (GF) plans to create a new center for advanced packaging and testing of ... bandwidth and density requirements in data centers and edge devices. Silicon photonics chips are ...

In a statement, GF said the AI boom had led to a growing need for silicon photonics and 3D and heterogeneously integrated (HI) chips to meet power, bandwidth, and density requirements in data centers ...

TAICHUNG, Taiwan (Reuters) - Nvidia's (NVDA) demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...