Strait Institute of Flexible Electronics (SIFE, Future Technologies), Fujian Key Laboratory of Flexible Electronics, Fujian Normal University and Strait Laboratory of Flexible Electronics (SLoFE), ...

Lastly, a simplified chemical vapor deposition (CVD) method was developed to create near-zero thickness SiNx films. This process combined controlled precursor pulses with continuous ammonia plasma ...

Their ability to be synthesized using diverse deposition techniques—ranging from highly sophisticated physical and chemical vapor deposition methods to more accessible approaches such as dip coating ...

University of Missouri scientists are unlocking the secrets of halide perovskites — a material that’s poised to reshape our future by bringing us closer to a new age of energy-efficient ...

Thin gold films offer a broad range of benefits for electronics due to their high electrical conductivity and transparency. Current manufacturing methods are unable to achieve gold films thinner than ...

In contemporary semiconductor manufacturing, electrostatic chucks (ESCs) securely hold a silicon wafer (or other substrate) ...

taking into account distinct cobalt deposition methods, namely, physical vapor deposition (PVD) and chemical vapor deposition (CVD). Results demonstrate that the presence of carbon delays the ...

The deposition of the polysilicon emitter is performed using the low-pressure chemical vapor deposition (LPCVD) furnace process ... Furthermore, this paper introduces an innovative method to modify ...

In addition to its technical efficacy, the hybrid corona-dielectric barrier discharge plasma technique presents itself as a sustainable alternative to conventional surface treatment methods employed ...