But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...

Abstract: The development of deep learning has led to increasing demands for computation and memory, making multi-chiplet accelerators a powerful solution. Multi-chiplet accelerators require more ...

A new technical paper titled “PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna. “2.5D integration technology is ...

Dr Xiaoxi He, Research Director, IDTechEx, explains how, in the rapidly evolving semiconductor industry, chiplet technology is emerging as a transformative force, offering innovative solutions to many ...

Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in- package (SiP). SiPs use ...

The 3 rd annual Chiplet Summit was held in Santa Clara from January 21 st to 23 rd at the Convention Center. The conference continues to grow from its 1 st year when it was held at the San Jose ...

SAN JOSE, Calif., Jan. 17, 2025 – QuickLogic Corporation (NASDAQ: QUIK), in collaboration with YorChip, is excited to announce its participation at the Chiplet Summit taking place at the Santa Clara ...

SAN JOSE, Calif., January 21, 2025--(BUSINESS WIRE)--Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO) an innovator in providing secure, high-speed connectivity solutions that deliver ...

During the summit, Alphawave Semi’s Chief Technology Officer, Dr. Tony Chan Carusone, will deliver a keynote titled ‘Scaling Connectivity for Chiplet-Based AI Systems’. The company’s technical experts ...

芯粒(Chiplet)的概念简单明了：根据所需要的功能选择最适当的工艺技术，开发最佳半导体后，再将各种Chiplet组合到多裸片封装中，就算大功告成了！这是一种实现先进半导体的低成本途径。 这个概念也意味着利用现有的半导体组件来实现标准功能，并将新的 ...