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AMD’s MI400 APU lands in 2026, boosting AI, HPC, and compute efficiency New design features two AIDs with eight XCDs, doubling MI300’s density Multimedia IO Die offloads IO tasks and may integrate ...

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MI400还会首次引入MID，也就是多媒体输入输出模块(Multimedia IO Die)，将多媒体引擎从AID中分离出来，肯定还会有其他一些IO模块。 MI400应该会配备两个 ...

The design features two Active Interposer Dies (AIDs), each containing ... The MI400 series also introduces a dedicated Multimedia I/O Die (MID) to enhance data throughput and processing efficiency.

MI400还会首次引入MID，也就是多媒体输入输出模块(Multimedia IO Die)，将多媒体引擎从AID中分离出来，肯定还会有其他一些IO模块。 MI400应该会配备两个MID，每个AID上一个。 值得一提的是，RX 9000系列游戏卡将会首次改用统一的UDNA架构，图形渲染、加速计算放在一起 ...