AMD's CNDA Next-infused MI400 APU could get a surprising new tile called Multimedia IO die but what will it do? I have an idea
An intriguing addition to the MI400 is the Multimedia IO Die (MID), which separates the multimedia engine from the AIDs. The ...
Digi Times19d
AMD instinct MI400 spotted in patches: up to 8 XCDs on dual interposer dies with new Multimedia I/O Die
The design features two Active Interposer Dies (AIDs), each containing ... The MI400 series also introduces a dedicated Multimedia I/O Die (MID) to enhance data throughput and processing efficiency.
Design-Reuse1y
Die-to-Die, High Bandwidth Interconnect PHY in TSMC (N7, N5)
the IP targets advanced 2.5D packaging to take advantage of much finer pitch die-to-die connections in interposer-based technologies, such as TSMC® Chip-on-Wafer-on-Substrate (CoWoS), than traditional ...
Design-Reuse5y
CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
"Active interposer technology will also be an enabler to integrate ... to create major differentiators in future work," Vivet said. Future work will address die-to-wafer hybrid bonding technology, ...