AMD's CNDA Next-infused MI400 APU could get a surprising new tile called Multimedia IO die ...
An intriguing addition to the MI400 is the Multimedia IO Die (MID), which separates the multimedia engine from the AIDs. The ...
Mysterious die set to feature in AMD's Instinct MI400, its next blockbuster APU which could ...
AMD’s MI400 APU lands in 2026, boosting AI, HPC, and compute efficiency New design features two AIDs with eight XCDs, doubling MI300’s density Multimedia IO Die offloads IO tasks and may integrate ...
Digi Times19 天
AMD instinct MI400 spotted in patches: up to 8 XCDs on dual interposer dies with new ...
The design features two Active Interposer Dies (AIDs), each containing ... The MI400 series also introduces a dedicated Multimedia I/O Die (MID) to enhance data throughput and processing efficiency.
Design-Reuse5 年
CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D ...
To scale out the architecture, existing techniques using 3D integration and chiplet partitioning with large-scale interposers were designed for building large modular architectures and achieving cost ...