Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

AXT, Inc. reports strong revenue growth from indium phosphide wafers but warns of a weak Q1-2025 outlook. Click for more on ...

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...

Another drawback of producing red LEDs on ScAlMgO 4 is the high cost of the substrate. Team spokesman Kazuhiro Ohkawa told ...

"There are opportunities for certain technologies from less than trustworthy sources to make it under the fence," said David Schild.

SCREEN Europe and IBIS Integrated Bindery Systems are set to showcase their latest partnership-driven innovations for secure ...

Printed Circuit Boards (PCBs) are the unsung heroes of modern electronics, providing the foundation for countless devices. While rigid PCBs have long been the industry standard, flexible PCBs (flex ...

(MENAFN- EIN Presswire) The GaN Diamond Semiconductor Substrates market is set for growth, fueled by advances in power Electronics and the demand for better heat management. As Per the SNS Insider ...

GlobalWafers chairperson Doris Hsu reports that prices for mainstream 6-inch silicon carbide (SiC) substrates have stabilized ...

Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.