Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market ...

Rayane Mazari, Technology & Cost Analyst, Semiconductor Packaging from Yole Group explains:“There is an increased implementation of high-end systems in high-performance computing, networking, ...

will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

G lobalFoundries (GF) plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its Malta, New York manufacturing facility. Supported by investments from ...

It will feature a baseline advanced packaging pilot line where companies and researchers can test and refine new processes before scaling them up for high-volume manufacturing. According to the ...

MALTA, N.Y., Jan. 17, 2025 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips ...

The company anticipates gradual growth throughout 2025, supported by the transition to HBM4, Foundry and Logic customer qualifications, and increasing demand across advanced packaging markets.