据介绍，这些技术将从 400 层的 NAND 闪存技术开始应用，而且他还提到，“键合技术可用于（在 NAND 区域）实现 1000 多层（堆叠）”。 IT之家注：晶圆键合是指分别制造外围晶圆和单元晶圆，然后将它们键合在一起形成单个半导体。 宋部长当天还公开展示了 1000 ...

SK Hynix will finalize its acquisition of Intel's NAND flash business, now rebranded as Solidigm, in March 2025. This strategic move strengthens its enterprise SSD (eSSD) market position and ...

据韩国媒体ZDNet Korea 2月24日报道称，三星电子近期已与中国存储芯片厂商长江存储签署了开发堆叠400多层NAND Flash所需的“混合键合”（Hybrid Bonding ...

与目前第8代的218层产品相比， 新一代3D闪存实现了33%的NAND接口速度提升，达到4.8Gb/s。 当前，3D NAND技术正在迅速发展，多家厂商正在加速推进300层以上的堆叠技术。 2月20日，日本铠侠控股（Kioxia Holdings）宣布，与闪迪联合开发的第10代BiCS 3D NAND闪存，无论堆叠 ...

Leveraging this unique high-speed technology, the companies expect the new 3D flash memory to achieve a 33 percent improvement in NAND interface speed compared with their 8 th generation 3D flash ...

Bottom line: The NAND flash industry is facing mounting pressure due to a combination of weak demand, oversupply, and declining prices. This challenging market environment has persisted throughout ...

IT之家2 月 17 日消息，市场研究机构 TrendForce 集邦咨询今日预测，2025 全年 NAND 闪存价格将大致呈 V 型走势，一季度下滑 13%~18% ...

NAND flash prices are expected to slide due to oversupply, forcing memory chipmakers to cut production to match lower-than-expected orders from PC and smartphone manufacturers. The superabundance of ...

However, its capex is expected to decrease by approximately 25% year-over-year in response to the accumulation of NAND Flash inventory. Save my User ID and Password Some subscribers prefer to save ...

The company has a new memory architecture called high-bandwidth flash that fuses the massive storage capacity of 3D NAND with the kind of bandwidth offered by HBM. This hybrid creation stacks up a ...

Dimensions (mm) 165.00 x 77.10 x 8.35 164.50 x 76.00 x 9.10 ...