Summary Manufacturers are rethinking organic and glass substrate capabilities as advanced packaging pushes toward sub ...

TAICHUNG, Taiwan (Reuters) - Nvidia's (NVDA) demand for advanced packaging from TSMC remains ... Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips.

advanced node spending is trending down while back-end spending (packaging/testing) is trending up. Shi added that advanced packaging related to CapEx will grow faster than overall CapEx.