According to a slide that Sandisk shared, HBF combines BiCS technology with CBA wafer bonding, allowing for efficient ...

Ariel Emerging Markets Value Composite fell - 9.99% gross of fees (-10.21% net of fees) in the quarter, trailing MSCI EM ...

Ariel International Composite declined -4.98% gross of fees (-5.12% net of fees) in the quarter, ahead of MSCI EAFE and MSCI ...

Micron Technology has announced the integration of its advanced LPDDR5X memory and UFS 4.0 storage in Samsung's latest Galaxy S25 series smartphones, enhancing multimodal AI capabilities for users.

Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That ...

The RAM market is set for a significant transformation in 2025, as Micron, Samsung, and SK Hynix—three of the world’s largest ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

Samsung is pulling out all the stops to win NVIDIA’s business for its high-bandwidth memory (HBM) modules. In an unusual move ...

Merck enhances South Koreas R&D and manufacturing for AI semiconductor materials Merck boosts collaboration to drive innovation in AI semiconductor production ...

The Trump administration’s plan to impose tariffs exceeding 25% on semiconductors is expected to have a significant impact on ...

The "big three" in the DRAM industry are preparing to end production of DDR3 and DDR4 memory solutions this year. Samsung Electronics, SK Hynix, and Micron ...

Major memory companies are planning to stop making DDR3 and DDR4 modules by 2025, shifting their production focus entirely to ...