BHUBANESWAR: Even as several IT companies have evinced keen interest to set up their units in Odisha, the state government is ...

Artificial intelligence (AI) and machine learning (ML) continue to push the limits of conventional semiconductor ...

In the wake of AI, unprecedented demand for data and computing power is outstripping capabilities. This will drive the ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

And it does make me wonder whether all the hype around AI is obfuscating other significant developments in the electronics space. If you believe, as I do, that heterogeneous integrated packaging is ...

( MENAFN - IANS) Bhubaneswar, Jan 29 (IANS) Odisha received a mammoth investment proposal of nearly Rs 20,900 crore in ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

If you're looking to dig into the world of hi-fi systems that consist of a separate stereo receiver or integrated amplifier that powers a set of passive speakers — whether your passion is ...

The high density and complex connectivity in advanced packaging introduce new challenges for packaging design and assembly ... performance, and area (PPA) in chiplet and heterogeneous integration.

Brands can consequently make measurable progress towards reducing their environmental impact by choosing EcoFit Lids to support their sustainability goals and contribute to a lower carbon footprint in ...

China's first heterogeneous humanoid robot training ... and help tackle the challenges posed by an aging population. The integration of advanced embodied intelligence and autonomous driving ...