Digi Times19 天
AMD instinct MI400 spotted in patches: up to 8 XCDs on dual interposer dies with new ...
The design features two Active Interposer Dies (AIDs), each containing ... The MI400 series also introduces a dedicated Multimedia I/O Die (MID) to enhance data throughput and processing efficiency.
Semiconductor Engineering10 天
Signal Integrity Plays Increasingly Critical Role In Chiplet Design
Chiplet design engineers have complex new considerations compared to PCB concepts. Maintaining the quality and reliability of ...
Mysterious die set to feature in AMD's Instinct MI400, its next blockbuster APU which could ...
AMD’s MI400 APU lands in 2026, boosting AI, HPC, and compute efficiency New design features two AIDs with eight XCDs, doubling MI300’s density Multimedia IO Die offloads IO tasks and may integrate ...
AMD's CNDA Next-infused MI400 APU could get a surprising new tile called Multimedia IO die ...
An intriguing addition to the MI400 is the Multimedia IO Die (MID), which separates the multimedia engine from the AIDs. The ...
AMD下下代AI加速卡Instinct MI400大变！多了一个Die
快科技2月3日消息，AMD已官宣将在今年下半年发布新一代Instinct MI350系列AI加速卡的首款产品MI355X，工艺升级台积电3nm，架构升级CDNA 4，引入FP6、FP4数据类型，搭配288GB HBM3E。 2026年，AMD将继续推出全新的Instinct MI400系列，再次升级架构，但细节暂未公开。 根据AMD最新提交的Linux系统补丁和已知信息，MI400仍然采用复杂的c ...
Semiconductor Engineering3 天
What’s Next In Advanced Packaging?
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets ...
The Next Platform3 天
Taking a closer look at Rambus’ HBM GEN2 PHY
Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...