Researchers find a faster way to etch deep holes for 3D NAND Plasma-based cryo-etching technique doubles etch speed, improving efficiency Faster etching might mean cheaper storage, but real-world ...

This emerging approach is called cryo etching. Traditionally, cryo etching uses separate hydrogen and fluorine gases to make the holes. The researchers compared results from this process to a more ...

However, the process, known as reactive ion etching, isn’t fully understood and could be improved. One recent development involves keeping the wafer — the sheet of semiconductor material to be ...

Researchers from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Laboratory (PPPL) investigated ways to speed up the cryogenic reactive ion etching process for 3D NAND ...

PSG, an operating company of Dover Corporation, has acquired Cryogenic Machinery Corp (Cryo-Mach), a specialized US designer and manufacturer of mission-critical cryogenic centrifugal pumps, ...

Researchers from Lam Research, the University of Colorado Boulder & PPPL doubled the etch rate for 3D NAND using hydrogen fluoride plasma in cryogenic reactive ion etching. Linköping University ...

This emerging approach is called cryo etching. Traditionally, cryo etching uses separate hydrogen and fluorine gases to make the holes. The researchers compared results from this process to a more ...

ISRO has successfully conducted a crucial vacuum ignition test of its indigenously developed CE20 cryogenic engine at its Propulsion Complex in Tamil Nadu. This test is part of ISRO's broader ...

It uses cryogenic (low-temperature) hydrogen fluoride plasma to etch the holes. In experiments, the etch rate more than doubled, increasing from 310 nanometers per minute with the old method to ...