The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build ...

In this modern era, high-performance computing (HPC) systems have become essential in addressing the increasing complexity of ...

Molex has launched a new line of EMI-filtered interconnects and RF components for aerospace and defense applications.

"These new RF components and EMI-Filtered interconnects extend Molex's legacy of RF excellence while adding significant product breadth and depth for tackling the toughest connectivity challenges," ...

Chip maker STMicroelectronics (ST) has revealed details of a new generation of proprietary technologies enabling faster ...

As the CPU speed reaches 3GHz and beyond, the I/O performance of a PC has increasingly become the bottleneck of the overall system performance. Traditionally, the I/O- subsystems are connected to the ...

A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding” was published by researchers at Aalto University in Finland. Abstract ...

STMicroelectronics has launched a new data center photonics chip, developed in collaboration with AWS. Dubbed the PIC100, ...

STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters New silicon photonics and next-gen ...

FNU Parshant's research highlights the impact of scalable interconnects and energy-efficient SoC designs in HPC ...