A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

2022年11月23日 · Using the underside of the IC package instead of connections around the edge makes it possible to reduce connection density, hence facilitating PCB layout. Using the underside of the chip prevents direct access to the connections, which makes soldering, desoldering, and inspection more challenging.

2000 Packaging Databook 14-1 Ball Grid Array (BGA) Packaging 14 14.1 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many.

2023年12月27日 · BGA (Ball Grid Array) packaging revolutionizes chip protection and heat dissipation in electronics. Unlike traditional methods, BGA arranges solder balls in a grid beneath the chip, offering controlled soldering and enhanced stability.

BGA , or Ball Grid Array, is a kind of a surface mount package which is used in electronic products to mount integrated circuits such as microprocessors, FPGAs, WiFi chips etc.

2024年8月29日 · Ball Grid Array or BGA is a surface-mount package (SMD Component) with no leads. This type of surface-mount packaging is used in Surface Mount Technology (SMT) and utilizes an array of metal spheres called solder balls for electrical interconnection.

2024年6月14日 · A BGA package is a surface-mount packaging type that uses a grid of solder balls to connect the IC to the PCB. The solder balls are arranged in a matrix on the bottom of the package, with the IC mounted on the top.

2023年7月14日 · What Is Ball Grid Array (BGA)? Ball Grid Array (BGA) is a type of integrated circuit (IC) packaging technology used in electronic devices. It is a surface-mount packaging method where the integrated circuit or chip is mounted directly onto a printed circuit board.

The BGA (Ball Grid Array) package is a type of integrated circuit packaging where the connection between the integrated circuit (IC) and the printed circuit board (PCB) is made through an array of solder balls arranged in a grid pattern on the underside of the package.

Since BGA allows the use of IC device packages with hundreds of pins (high density miniature processing chips). Integrate more functions in a smaller space, so BGA packages are often used in high-density PCB products.