2021年7月26日 · Intel provided the following insights into the company’s industry-leading advanced packaging roadmap: EMIB (embedded multi-die interconnect bridge) continues to lead the industry as the first 2.5D embedded bridge solution.

2023年9月6日 · Intel has led the industry in advanced packaging for a couple decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).

Redefine Compute Through Packaging Innovations. Join Intel Foundry’s goal of 1 trillion transistors in a package by 2030 with 2D, 2.5D, and 3D packaging leadership.

This paper reviews the latest Intel innovation, including how we use advanced packaging technologies to ensure high quality and reliability. It explains Intel’s unique packaging quality and reliability verification process, developed to make sure that complex Intel products meet or exceed customer expectations.

2024年1月24日 · On Wednesday, Intel announced that Fab 9 had begun operations at its Rio Rancho site in New Mexico. The $3.5 billion production facility was built to package chips using Foveros 3D technology...

2023年8月24日 · Intel is set to quadruple its advanced packaging capacity as demand for the technology soars. Chip-giant Intel (INTC 0.26%) is dead set on reclaiming its manufacturing edge over foundry...

2024年1月25日 · Intel's Foveros is a die-to-die stacking technology that uses a base die produced using the company's low-power 22FFL fabrication process and chiplet dies stacked on top of it. The base die can...

2019年7月9日 · What’s New: This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology.

2024年8月13日 · Earlier this month, Intel announced that its lead internal products on the Intel 18A process came out of the fab and have powered-on and booted their operating systems. The company indicated its first external customer for 18A will tape out in the first half of next year.

2025年1月21日 · With these and other research contributions, Intel Foundry continues to pave the way for the future of semiconductor manufacturing and the delivery of trillion-transistor systems by 2030. Advanced Packaging. Advanced packaging is …