The wafer level chip scale package (WLCSP) is a variant of the flip-chip interconnection technique where all packaging is done at the wafer level. With WLCSPs, the active side of the die is inverted and connected to the printed circuit board (PCB) using solder balls.

Wafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as Advanced Semiconductor Engineering (ASE). [4]

This application note provides an overview of Broadcom's WLCSP (Wafer-Level Chip Scale Package) technology and includes design and manufacturing guidelines for high yield and high reliability assembly.

Wafer Level Chip Scale Packaging (WLCSP) refers to the technology of packaging an integrated circuit at wafer level, resulting in a device practically the same size as the die.

Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer.

Chip scale packages can be classified into the following groups: Customized leadframe-based CSP (LFCSP) Flexible substrate-based CSP; Flip-chip CSP (FCCSP) Rigid substrate-based CSP; Wafer-level redistribution CSP (WL-CSP)

This application note provides guidelines and recommendations for wafer chip scale packages (WCSP). WCSP is a package type that is completely processed in wafer form; and when singulated, the package is

Guidelines for package performance information such as Moisture Sensitivity Level (MSL) rating, board level reliability, and thermal resistance data are included as reference. This document contains generic information that encompasses Wafer Level Chip Scale Packages (WLCSP).

Wafer-level Chip-Scale Package FAQs Includes answers to questions about TI’s WCSP packaging technology’s advantages and proper practices to work with WCSP devices. What is WCSP?

2007年4月18日 · This article first defines the terms \"flip chip\" and \"chip-scale package\" and explains the technical development of wafer-level packaging (WLP) technology. Next it discusses practical aspects of using wafer-level packaged devices.